Gas Pressurized Hot Embossing - A Novel Method is Developed
Sen-Yeu Yang, Jer-Haur Chang
Department of Mechanical Engineering, No. 1 Sec. 4, Roosevelt Road, Taipei, Taiwan, R.O.C
Taiwan Republic Of China

Keywords: Gas Pressurized Hot Embossing, Hot Embossing, Replication


Though hot embossing has proven itself productive for the parallel replication of precision micro-structures at low cost, the replication accuracy and area are limited due to its inherent non-uniform pressure distribution. Traditional hot embossing is pressed directly by hot plate using press machine. Wafer is not applicable as the embossing tool. Pressure was also higher in the intermediate zone and lower in the margin zone. Embossing tool, area and replication accuracy is limited. This paper reports an innovative method for hot embossing using gas as pressure media. The film/stamper/substrate stack was placed in a closed chamber. After heating, the high gas was blown in to pressurize the stack. Micro patterns in the stamper were found sucessfully replicated. Using this method, perfectly uniform embossing pressure throughout whole area is achieved. Glass or wafer with micro-features on the surface can be used as stamper directly.