The issue of electronic heat dissipation has received much attention in recent decades and has become one of the key factors in electronic components. In many cases, Electronic components often fail because of damage resulting from excessive operating temperatures. Due to this, Highly thermal conductive and electrically insulating polymer materials are important for thermal management of numerous applications in new generation electronic devices, but the low thermal conductivity of polymers is one of the major technological barriers. One of the common methods to increase the thermal conductivity of polymers is adding conductive fillers into them. By introducing carbon-based fillers both thermal and electrical conductivity increase because in carbon-based materials free electrons are responsible for conduction. However, in ceramic-based fillers, the lack of free electrons make phonon (lattice vibration) responsible for thermal conduction, Although the thermal conductivity value is much lower than carbon-based fillers. So, enhancement of the thermal conductivity without sacrificing the electrical insulation remains as a challenge. In this work, both high thermal conductivity and high electrical resistivity of immiscible Polypropylene (PP)/Polyamide 6 (PA6) blends are achieved by using a combination of Boron nitride (BN) and Reduced graphene oxide (rGo) as hybrid fillers. In this study, the samples were prepared by two difference mixing sequences to investigate the effect of hybrid fillers on morphological development and its influence on the thermal conductivity of Polyamide6 (PA6)/ Polypropylene (PP) blends. In the first feeding order, the conductive fillers (BN and BN/rGo hybrid) were first melt compounded with PA6 to produce PA blend master batch (PA-BN and PA-BN-rGo) and then appropriate amounts of PA-BN and PA-BN-rGo were melt-mixed with PP for preparing PP/PA-BN, PP/PA-BN-rGo10 and PP/PA-BN-rGo 15 nano composites. In the second feeding order in which the rGo wa