pps proceeding
Symposium: S15 - Rheology and rheometry Oral Presentation
Development of evaluation method of heat resistance of ternary UV curable resin for stereolithography by photo rheometer
Nishimura Ayumi (1)*
(1) School of Mechanical Engineering, College of Science and Engineering, Kanazawa University - Ishikawa - China
We report a method to evaluate the heat resistance of ternary UV curable resin of acrylic, epoxy, oxetane for stereolithography, using a photo - rheometer capable of measuring viscoelasticity while irradiating ultraviolet rays. As a light source, a high pressure mercury lamp was used.