Rheological and thermal equipment were employed to measure successfully material properties of thermoset injection molding compounds, which was then used as input data in writing a numerical method to model cure kinetics and reactive viscosity equations for thermosets injection molding simulation. All fitted parameters of the cure kinetics and reactive viscosity models were obtained via the developed numerical algorithm, which was directly imported into Moldex3D simulation tool to evaluate its application in prediction of mold filling behavior of thermoset injection molding compounds. In addition, the wall slip phenomenon of thermoset injection molding compounds in the presence of a wall surface which was investigated and visually detected during the experimental process was considered in the computation simulation process. A remarkable agreement between simulation and experimental results was found, indicating that the developed numerical method for generating thermoset material data for the reactive injection molding simulation process is reasonable and it is impossible to ignore the influence of wall slip during the thermoset injection molding simulation process.