pps proceeding - Abstract Preview
pps proceeding
Symposium: S05 - Novel processing technologies
Poster Presentation
 
 

Hot Embossing of Microstructures with Moving Induction Heating and Gas-Assisted Pressuring

Kao Ching-Chieh (1), Ke Kun-Cheng (1), Chang Nai-Wen (1), Hung Wei-Cheng (1), He Jyun-Wei (1), Yang Sen-Yeu (1)*

(1) National Taiwan University - Taiwan - Taiwan

New devices for moving induction heating and gas-assisted hot embossing were developed. A mechanism was designed and implemented to move a platform in and out of a wrapped coil, on which a sealed box for the substrate and mold were placed. A chamber 195 mm in diameter and 221 mm in length was machined. A movable platform, sealed box with a substrate and mold stack, wrapped coil, and cooling fan were all implemented in a high-pressure chamber. Nine-point thermocouples were attached to the mold, and a temperature history of moving induction heating was obtained. The influence of the movement path and power on the heating rate and temperature distribution was studied. A micro V-cut structure hot embossing experiment was performed to validate this moving induction heating and gas-assisted pressuring hot embossing for the fast fabrication of microstructures on polymeric substrates. Results indicated that replication rates were higher than 95% at 200°C and 5 kgf/cm2, whereas the cycle time was less than 4 min. Optic measurement showed that the illuminance of the replicated V-cut film was enhanced by 36.8%. The experimental results evidence the manufacturing potential of this apparatus.