pps proceeding - Abstract Preview
pps proceeding
Symposium: S08 - Polymer blends
Oral Presentation
 
 

Increasing thermal conductivity by interface modification

Seyed Esfahani Seyed Armin (1), ghahramani Nikoo (2), Mehranpour Milad (1)*, Nazockdast Hossein (2)

(1) Islamic Azad university,Science and Research Branch - Tehran - Iran, (2) Polymer Engineering Department, Amirkabir University Of Technology - Tehran - Iran

Nanoscale thermal transport has attracted considerable attention because of both fundamental scientific interest and important engineering applications. In ceramic based composites, phonon is responsible for thermal conduction. Phonon (lattice vibration) is affected by phonon scattering due to high thermal boundary resistance caused phonon scattering across the interface between the components which is lead to reduce thermal conductivity. Double percolation has been widely used to reduce the filler volume fraction. In this method interface between two phases is where the probability of phonon scattering is high. One way to reduce phonon scattering is localization of conductive nano fillers at the interface of the polymer blends. In this work localization behavior of reduce graphene oxide (rGO) and Boron nitride (BN) in melt mixed blend of polypropylene (PP) and polyamide 6 (PA6) were investigated. The blends were prepared with different mixing sequence to investigate different selective localization of fillers By trapping r-GO in the interface of polymer blends. therefore, interfacial resistance significantly reduced, it means that phonon scattering reduced and thermal conductivity increased in comparison when the interface is not filled by any conductive nano fillers. The results are verified by rheological measurement and electron microscopy images.