pps proceeding - Abstract Preview
pps proceeding
Symposium: S08 - Process Monitoring, Control and Sensors
Poster Presentation
 
 

Prediction of degree of cure from temperature profile during cure reaction of epoxy resin.

Bastola Jeeban (1), Eun Park Go (2)*

(1) Chonbuk National University - Jeonju - SouthKorea, (2) Chonbuk National University - Chonbuk - Korea

Carbon fibre reinforced polymer (CFRP) composite are made by combining a plastic polymer together with reinforced carbon fibre. CFRP composites have been widely used in aerospace, luxury automobile, defense, sports goods and wind turbines because of their higher mechanical and light weight properties. Usually, thermosetting resin is used as matrix to improve the materials mechanical properties, enhances the chemical resistance, heat resistance and structural integrity. Cure monitoring of thermosetting resin is very important for the quality control and reliable manufacturing of composite products. Nowadays, many different analytical methods have been studied to characterize the cure reaction and monitor the cure process of thermoset epoxy resin, such as differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA). DSC is a thermal analysis technique used to measure the difference in the amount of heat flow rate necessary to increase the temperature of a sample and a reference as a function of temperature. It is a widely used experimental technique to obtain a thorough understanding of the cure process. DMA is a technique that is widely used to characterize a material’s properties as a function of temperature, time, frequency, stress, or a combination of these parameters. These methods, however, cannot practiced for online cure monitoring because they are only performed in laboratories under ideal conditions. The online measurement and control the cure process are very important for uniformity and quality of materials. Many researchers are studying the online cure monitoring as well as improving manufacturing methods by using different kinds of sensors such as fiber Bragg grating (FBG) sensor and dielectric sensor. However, these sensors are highly expensive and used as disposable materials. Therefore, we want to predict the degree of cure from temperature curve only. In this study, the dissipation factor and temperature were measured during the cure