pps proceeding - Abstract Preview
pps proceeding
Symposium: S11 - (General Session 11) Polymer Composites
Poster Presentation
 
 

Morphological Studies of Conductive Carbon during Tensile Deformation using Shape-Memory Polymer

So Yujin (1), Park Changsin (1), Kim Han Gil (1), Lee Jong Whan (1), Lee Sang Whan (1), Kim Yeon Ju (1), Nah Changwoon (1)*

(1) BK21 Plus Haptic Polymer Composite Research Team of Chonbuk National University - Jeonbuk - SouthKorea

Conductive carbon-filled rubber composites have been used for high and multi-functional performance. Several recent researches show the possibility of being used as sensors to monitor the mechanical deformation. The conductive networks of conductive fillers such as carbon blacks are formed in the rubber matrix above the certain loading level, so called percolation threshold, and the networks are changing with mechanical deformation due to the change in the network structure. Moreover the changed networks are not recovered right after the deformation is eliminated (unloading cycle). The change of network structure during deformation is not fully understood yet. In this study, a high-styrene styrene-butadiene rubber (HS-SBR) having a glass transition temperature, Tg, of 38 „aC is selected as the shape-memory polymer material. This material shows the typical rubber-like behavior far above the Tg, and it shows a typical plastic behavior at room temperature. All the mechanical deformations are applied at 80„aC, and the deformed samples are cooled to room temperature to keep the deformed structure of the conductive carbon networks. The conductive network morphology before and after stretching is investigated by field-emission scanning electron microscopy (FE-SEM). It can be clearly seen that the conductive carbons are oriented to the direction of straining. Thus the newly attempted technique is a promising method to fix the morphology of filler networks in the deformed rubber compounds. Keywords: High-styrene styrene-butadiene rubber, Conductive carbon black, Morphology, FE-SEM