Epoxy resins have long been extensively used in industries due to the extreme versatility in chemical structures, low volatility during curing, much less shrinkage than that encountered in polymerizations, excellent adhesion and chemical resistance. They have found wide applications in the electronic industries such as printed wiring board (PWB), epoxy molding compounds (EMC), adhesives, and encapsulates, etc. This paper specifically addresses the effect of chromium (III) octoate catalyst on curing behavior and mechanical properties of silica filled epoxy/anhydride compounds at a low curing temperature. The epoxy part (Part A) and the hardener part (Part B) were prepared and they were mixed with various weight ratio ranged from 0.9/1 to 0.5/1 using paste mixer. The mixtures were degassed in a vacuum oven at 50°C for 20 minutes and were cured in an oven at 71°C for 40 hours. Thermal analysis was performed on a Q20 differential scanning calorimeter (TA Instruments, USA) at a heating rate of 10°C•min-1 to calculate the conversion from the decrease of the area corresponding to the curing exothermic peak during the formation of the epoxy cured network. Epoxy molding compounds were cut into rectangular-column shaped specimens (dimensions: 12.7 mm ×12.7 mm × 40.6 mm, ASTM D 695) for the measurement of mechanical properties on a universal testing machine (Instron 8801, USA) at a crosshead speed of 1.3 mm•min-1 at room temperature. Epoxy-anhydride compounds containing chromium (III) octoate showed a high conversion at 71°C for 40 hours as well as a good processability at room temperature. As a result of the mechanical properties of the cured epoxy/anhydride compounds, the epoxy molding compounds of 0.5/1 ratio (Part A/Part B) showed the best compressive strength. It means some of the anhydride curing agent in Part B was not actively react during curing, so further studies on this topic will be presented in a subsequent research.