Single emulsion system is applied to prepare epoxy droplets in heated corn oil, which composes of epoxy, polyamide, blowing agent and conductive filler. The use of reversed ratio of epoxy and polyamide as called polyamide-epoxy adduct induces a low crosslink density of the cured matrix, so that it was able to be cured and blown simultaneously under decomposition of the blowing agent to form conductive epoxy micro-foam (CEMF). The low density of CEMF will surmount the sedimentation of conductive filler during preparation of composite. The dispersion of conductive filler on the foam’s cell wall will contribute the electrical conductivity to the composite filled CEMF. Content of conductive filler in CEMF is measured by using Thermogravimetric Analyzer (TGA). Glass transition of CEMP matrix is studied by using Differential Scanning Calorimetre (DSC).