More and more, components and products made of polymers using additive manufacturing processes are manufactured not only as prototypes, but also as components with integrated functionality. The use of advanced 3D printing technologies enhanced with component placement and electrical interconnect deposition can provide structural electronic systems with higher fabrication freedom and embedded circuitry in more complex shapes. However, with more electrical functionality being integrated into 3D printed structures, various material properties, e.g. thermal conductivity and chemical resistance, become increasingly important. Thermosetting resins that are used as adhesives in electronic packaging processes have the potential to meet these requirements. This paper describes an additive manufacturing process for manufacturing housings with integrated electrical functionality and presents experimental work to demonstrate the behaviour of adhesives used as building material. On the basis of own investigations, the question is discussed in how far well-established dual-curing adhesive systems, today used in 2D applications, can be processed efficiently to build 3D structures by an extrusion-based process. As 3D-printing processes are known for anisotropic part behaviour caused by print orientation and layer-by-layer build-up, the influence of the build-up process on adhesive material systems has to be considered. In order to examine this, the effect on thermal and mechanical properties of the resulting 3D printed structures is characterized exemplarily for one material, from which first statements about anisotropy can be deduced.