Polymers are generally thermal insulators and their applications are limited by their low thermal conductivity. There has been an increasing demand for the materials with high thermal conductivity called Thermal Interface materials that can dissipate heat generated by electronic devices during operation. So an approach to improve the heat transfer through polymers is the inclusion of fillers with high thermal conductivity. In this paper, Hexagonal Boron Nitride (h-BN) and graphene with different weight ratios are used as fillers in the epoxy systems and their tensile, thermal and electrical properties were compared. In this process, h-BN synthesis was made using the wet chemical method with the controlled number of layers. This method involves the reaction of boric acid with urea, wherein the relative proportions of the two have been varied. Synthesized h-BN along with the graphene are incorporated as fillers into the epoxy systems. The thermal conductivity of the epoxy composite of h-BN is enhanced more than 5 times of the neat epoxy. Electrical resistance increases with the addition of h-BN into the systems, this property is an added advantage over graphene making h-BN fillers as excellent sources for high conductivity interface materials.