In general, the electroless plating had been selected for plating of insulator. In this plating process, the etching by plasma modification is restricted by its construction. Furthermore, especially when to select the Acrylonitrile-Butadiene-Styrene (ABS) as the base material, the harmful wastewater, including Cr (IV) be generated by the chemical etching process. The other, we had studied the polyethylene (PE) surface modification activity of the Side Chain Crystalline Block Co-polymer (SCCBC); which has the crystalline unit (alkane like chain) as be adsorbed on to the PE, and the functional unit. As an example, the results showed the hydrophobic PE surface (97°) change to hydrophilic (74°). In this study, we polymerized the new SCCBC and investigated the possibility of change the chemical etching process to SCCBC surface modification process.