Components and products made of polymers using additive manufacturing processes are more and more manufactured not only as prototypes but also as components with integrated functionality. However, with more electrical functionality being integrated into 3D printed structures, various material properties, e.g. thermal and chemical resistance, become increasingly important. Thermosetting resins that are used as adhesives in electronic packaging processes have the potential to meet these new requirements. As 3D-printing processes are known for anisotropic part behaviour caused by print orientation and the layer-by-layer build-up the influence of the build-up process on adhesive material systems has to be considered. This paper presents experimental work to demonstrate the behaviour of adhesives used as build material in additive manufacturing. Investigations are discussed how dual-curing adhesive systems, today used in 2D applications, can be processed efficiently to build 3D structures. Different contour-building, layer-filling and curing strategies are considered and recommendations are derived. In order to examine the influence of printing orientation on part quality and properties, the effect on the thermal and tensile properties of the resulting 3D printed structures is characterized. By analysing different types of material systems (e.g. epoxy- or acrylate-based) first statements can be made on anisotropic behaviour of adhesives. Furthermore, as thermal properties are considered, the data can be used to qualify additive manufacturing with this material for new applications.