Electronic packaging, or assembly of packed electronic components on printed circuit boards (PCBs), present challenges that require Innovative solder pastes and electrically conductive adhesives (ECA) to face the increasing complexity of PCB assembly, with denser board occupation and demanding thermal management during assembly. Current conductive adhesives, commercially available, are based on epoxy matrices with a high load (~80 %) of silver, typically as micro flakes. Several studies have reported improvements using multidimensional materials, such as silver nanowires and micro flakes, or multiple scales as micro and nano-particles [1]. Carbon nanotubes have also been used as fillers for ECAs [2] In this work, epoxy resin composites were produced with different carbon fillers including, carbon nanotubes (single- and multi-wall, SWCNT and MWCNT), graphite (as is and exfoliated), carbon nanofibers (CNF) and chopped carbon fibers (CF) to achieve thermal stability, low electrical resistance and vibration damping. Different concentrations of each carbon material, separately or combined, were explored. The concentration ranges tested were, 0.001-0.3 wt.% for SWNT, 0.001-3 wt.% for MWNT, 0.01-1 wt.%, for graphite, 0.3-13 wt.% for CNF and for CF 1-35 wt.%. The ECAs were produced by manually pre-mixing the epoxy and carbon filler and then using a three roll mill. The mixture was processed to obtain a good dispersion of the fillers and cured after mixing with the hardener for 1 hour at 80 ºC. The effect of the different fillers and concentrations on the electrical, rheological and mechanical properties of the ECAs were evaluated Acknowledgments This research is sponsored by the Portugal Incentive System for Research and Technological Development. Project in co-promotion nº 002814/2015 (iFACTORY 2015-2018). References [1] Meschi Amoli, B., Hu, A. et al., J Mater Sci: Mater Electron (2015) 26: 4730. [2] Santamaria, A.; Muñoz, M. E. et al., J. Appl. Polym. Sci. 2013, 129, 1643.