In the long term, renewable raw materials should be used as alternative materials for applications in electronic industry. The reason for the low level of dissemination of bioplastics in electronics are the high material requirements in this area. In this work, thermoplastic lignin is used as renewable raw material for electronic applications, precisely for a substrat material for printed circuit boards. Lignin is a waste product of the paper industry, and thus inexpensive and available in large quantities. In this work, lignin based substrates are produced via extrusion technology and will subsequently be laminated with copper foil in a press. The goal is to achieve sufficient and good mechanical, thermal and electrical properties as well as high peel strength to copper. Additives and different kind of fillers are embedded into the lignin matrix to obtain an increase in the mechanical and chemical properties. Thus, in the extrusion process, parameters are optimised and the influences of additives and fillers on the mechanical, thermal and rheological properties are investigated (structure-property-relationships). For the lamination with copper, different press processes are characterized. The results show that lignin based substrate materials (foils) can successfully be produced via extrusion using a slot die followed by a calander unit. With a filler content of 40 wt. %, the substrate material shows good mechanical behaviour (tensile tests and breakdown tests). The water absorption and the adhesion of the copper foil are in the range of FR4, which is the standard substrate material for printed circuit boards. The maximum operating temperature, the time to delamination and the coefficient of thermal expansion are below the values of FR4. This is related to the known thermal differences of biopolymers and thermosets. Nevertheless, the developed lignin based substrate material can be successfully used in a demonstrator circuit board in a non-automated process.