Thermoforming is one of the oldest and most important further processes in plastics engineering. Typical applications are packaging and large-scale products. Here thermoforming is more cost-efficient, has shorter cycle times and can manage larger geometries than other processes. The overall thermoforming costs are dominated by material costs. As a result, it is reasonable to make thermoforming even more cost-efficient by means of e.g. sheet-thickness-reduction, intelligent mold design and reduction of production rejects. These approaches require a wide knowledge of material behavior and can be supported by thermoforming-simulation. To obtain high predictive accuracy in thermoforming-simulation a material-testing-method is needed that matches with the actual thermoforming process. Therefore the IKT developed the Thermoform-Material-Characterization-Test (TMC-Test). Besides the general description of a material’s thermoforming characteristics, the TMC-Test can also provide material data for thermoforming-simulation. First of all, the IKT’s procedure for thermoforming-simulation is described. Next, the setup of the IKT’s TMC-Apparatus is explained and it is examined how material parameters can be extracted from the TMC-Test by Reverse-Engineering. Finally, the IKT’s method for thermoforming-simulation is validated by an exemplary thermoforming-simulation. The predictive accuracy of the IKT’s procedure is being quantified by the relation of processed and simulated sheet-thickness-distribution.